Joint plating
Introducing Mitsuya's recommended joining coatings!
■Gold-Tin Alloy Plating Gold-tin alloy plating, composed of 80% gold and 20% tin eutectic, is the optimal alloy plating for high-temperature lead-free solder materials with a melting point of 280°C. ■Tin-Antimony Alloy Plating Compared to regular tin plating, it excels in preventing tin pest and has superior heat cycle durability. ■Indium Plating Indium has a very soft, dull white appearance and is prone to scratching. Its hardness is below Hv5, and its melting point is 156.6°C. It has also proven effective in preventing contact failure as a joining tool for bundling similar vessels.
- Company：株式会社三ツ矢
- Price：Other
